About the Role
Specializes in advanced packaging technologies for AI hardware, contributing to the design and development of next-generation AI systems. This role involves expertise in material science, thermal management, and chip integration.
Specializes in advanced packaging technologies for AI hardware, contributing to the design and development of next-generation AI systems. This role involves expertise in material science, thermal management, and chip integration.
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This role is based in San Francisco. Check the full description for remote or hybrid options.
This position was posted 3 days ago. We recommend applying promptly as positions can fill quickly.